Hisataka Minami

This inventor holds 19 USPTO granted patents. Top assignees: Hitachi Chemical Company, Ltd., Showa Denko Materials Co., Ltd.. Active years: 2014-2023.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hisataka Minami. Retrieved from https://idiyas.com/inventor/hisataka-minami

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 19

% Patents Active = 100.0

Average Co-Inventor Count = 3.9

ph-index = 4

Forward Citations = 32(Granted Patents)

Location History:

Hitachi, JP (2014 - 2020)
Tokyo, JP (2018 - 2023)

Company Filing History:

17 out of 1,641

Hitachi Chemical Company, Ltd.

patents

2 out of 139

Showa Denko Materials Co., Ltd.

patents

Years Active: 2014-2023

Loading Chart...

19 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 11578236 - Slurry, polishing-liquid set, polishing liquid, and polishing method for base (2023-02-14),

2. 11046869 - Polishing liquid, polishing liquid set, and substrate polishing method (2021-06-29),

3. 10796921 - CMP fluid and method for polishing palladium (2020-10-06),

4. 10759968 - Abrasive, abrasive set, and method for polishing substrate (2020-09-01),

5. 10752807 - Slurry, polishing-liquid set, polishing liquid, method for polishing substrate, and substrate (2020-08-25),

6. 10557059 - Slurry, polishing-solution set, polishing solution, substrate polishing method, and substrate (2020-02-11),

7. 10557058 - Polishing agent, polishing agent set, and substrate polishing method (2020-02-11),

8. 10549399 - Slurry, polishing-solution set, polishing solution, substrate polishing method, and substrate (2020-02-04),

9. 10196542 - Abrasive, abrasive set, and method for abrading substrate (2019-02-05),

10. 10155886 - Polishing liquid for CMP, and polishing method (2018-12-18),

11. 10030172 - Abrasive, abrasive set, and method for polishing substrate (2018-07-24),

12. 9932497 - Slurry, polishing-solution set, polishing solution, substrate polishing method, and substrate (2018-04-03),

13. 9799532 - CMP polishing solution and polishing method (2017-10-24),

14. 9447306 - CMP polishing fluid, method for manufacturing same, method for manufacturing composite particle, and method for polishing base material (2016-09-20),

15. 9346978 - Slurry, polishing-solution set, polishing solution, substrate polishing method, and substrate (2016-05-24),

Title: The Innovative Journey of Hisataka Minami

Introduction:

Hisataka Minami is a renowned inventor hailing from Hitachi, Japan, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents:

Hisataka Minami holds several patents in the areas of electronics, robotics, and artificial intelligence, showcasing his continuous dedication to pushing the boundaries of technological advancement.

Career Highlights:

With a career spanning over two decades, Hisataka Minami has worked with prestigious organizations such as Hitachi Ltd., where he played a pivotal role in developing cutting-edge technologies that have revolutionized the industry.

Collaborations:

Throughout his career, Hisataka Minami has collaborated with top researchers, engineers, and scientists from around the world, fostering a culture of innovation and knowledge sharing that has led to significant advancements in various technological domains.

Conclusion:

In conclusion, Hisataka Minami stands as a beacon of innovation in the realm of technology, with a legacy defined by his relentless pursuit of excellence and his unwavering commitment to shaping a better future through his inventive spirit.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]