The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 20, 2016
Filed:
Jan. 20, 2012
Applicants:
Hisataka Minami, Hitachi, JP;
Keisuke Inoue, Hitachi, JP;
Chisato Kikkawa, Hitachi, JP;
Yutaka Nomura, Hitachi, JP;
Tomohiro Iwano, Hitachi, JP;
Inventors:
Hisataka Minami, Hitachi, JP;
Keisuke Inoue, Hitachi, JP;
Chisato Kikkawa, Hitachi, JP;
Yutaka Nomura, Hitachi, JP;
Tomohiro Iwano, Hitachi, JP;
Assignee:
HITACHI CHEMICAL COMPANY, LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09G 1/02 (2006.01); H01L 21/306 (2006.01); C09K 3/14 (2006.01); H01L 21/3105 (2006.01); B24B 37/04 (2012.01);
U.S. Cl.
CPC ...
C09G 1/02 (2013.01); B24B 37/044 (2013.01); C09K 3/1463 (2013.01); H01L 21/30625 (2013.01); H01L 21/31053 (2013.01);
Abstract
A CMP polishing liquid comprises water and an abrasive particle, wherein the abrasive particle comprises a composite particle having a core including a first particle, and a second particle provided on the core, the first particle contains silica, the second particle contains cerium hydroxide, and the pH of the CMP polishing liquid is equal to or lower than 9.5.