The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 06, 2020
Filed:
Feb. 05, 2010
Hisataka Minami, Hitachi, JP;
Ryouta Saisyo, Hitachi, JP;
Jin Amanokura, Hitachi, JP;
Yuuhei Okada, Hitachi, JP;
Hiroshi Ono, Hitachi, JP;
Hisataka Minami, Hitachi, JP;
Ryouta Saisyo, Hitachi, JP;
Jin Amanokura, Hitachi, JP;
Yuuhei Okada, Hitachi, JP;
Hiroshi Ono, Hitachi, JP;
HITACHI CHEMICAL COMPANY, LTD., Tokyo, JP;
Abstract
The CMP polishing liquid for polishing palladium of this invention comprises an organic solvent, 1,2,4-triazole, a phosphorus acid compound, an oxidizing agent and an abrasive. The substrate polishing method is a method for polishing a substrate with a polishing cloth while supplying a CMP polishing liquid between the substrate and the polishing cloth, wherein the substrate is a substrate with a palladium layer on the side facing the polishing cloth, and the CMP polishing liquid is a CMP polishing liquid comprising an organic solvent, 1,2,4-triazole, a phosphorus acid compound, an oxidizing agent and an abrasive.