Hitachi, Japan

Masato Fukasawa

This inventor holds 21 USPTO granted patents and 7 published patent applications and 1 EPO patent, primarily in CMP Polishing Technology. Top assignees: Hitachi Chemical Company, Ltd., Showa Denko Materials Co., Ltd., Toshiba Tec Kabushiki Kaisha. Active years: 1990-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Masato Fukasawa. Retrieved from https://idiyas.com/inventor/masato-fukasawa

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 21 

% Patents Active = 81.0

 

Average Co-Inventor Count = 4.7

ph-index = 6

Forward Citations = 115(Granted Patents)


Location History:

  • Ibaraki, JP (2011)
  • Hitachi, JP (1990 - 2016)
  • Tokyo, JP (2021)

Company Filing History:


Years Active: 1990-2026

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Areas of Expertise:
CMP Polishing
Polishing Slurry
Metal Films
Substrate Polishing
Abrasive Slurry
Electrophotographic
Polishing Solution
Polishing Method
Polishing Liquid
Polishing Device
21 patents (USPTO):Explore Patents

Title: Masato Fukasawa: Innovator in Polishing Technologies

Introduction

Masato Fukasawa, based in Hitachi, Japan, is an accomplished inventor with a remarkable portfolio of 20 patents. His groundbreaking contributions in the field of polishing technologies have positioned him as a notable figure in the advancement of materials processing.

Latest Patents

Fukasawa's latest patents showcase his innovative approaches to polishing liquids and methods. One such patent describes a polishing liquid that consists of a liquid medium, abrasive grain, and a polymer. The polymer includes a first molecular chain with a functional group and a second molecular chain branched from it, with the functional groups encompassing carboxyl groups, carboxylic acid salt groups, hydroxyl groups, sulfo groups, and sulfonic acid salt groups. Another significant patent pertains to a polishing method for substrates which incorporate silicon nitride as a stopper along with wiring metal and insulating materials. This method utilizes a CMP (Chemical Mechanical Planarization) slurry containing a refined copolymer and specific components to achieve efficient polishing.

Career Highlights

Throughout his career, Masato Fukasawa has worked with prominent companies such as Hitachi Chemical Company and Showa Denko Materials. His experience in these organizations has significantly influenced his work and has contributed to the development of innovative polishing technologies.

Collaborations

Fukasawa has collaborated with several talented professionals, including Naoyuki Koyama and Kouji Haga. These collaborations have fostered an environment of innovation and have led to the successful development of advanced polishing solutions.

Conclusion

Masato Fukasawa's extensive patent portfolio and innovative contributions to polishing technologies reflect his expertise and commitment to the field. His work continues to inspire advancements and improvements in material processing techniques, making a substantial impact on the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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