The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 03, 2013
Filed:
Jan. 31, 2007
Masato Fukasawa, Hitachi, JP;
Kazuhiro Enomoto, Mito, JP;
Chiaki Yamagishi, Hitachi, JP;
Naoyuki Koyama, Hitachi, JP;
Masato Fukasawa, Hitachi, JP;
Kazuhiro Enomoto, Mito, JP;
Chiaki Yamagishi, Hitachi, JP;
Naoyuki Koyama, Hitachi, JP;
Hitachi Chemical Company, Ltd., Tokyo, JP;
Abstract
The present invention provides a CMP abrasive slurry for polishing insulation film, that allow efficiently and high-speed polishing of insulation films such as SiOfilm and SiOC film in the CMP method of flattening an interlayer insulation film, a BPSG film, an insulation film for shallow trench isolation, or a wiring-insulating film layer, a polishing method by using the abrasive slurry, and a semiconductor electronic part polished by the polishing method. A CMP abrasive slurry for polishing insulation film containing cerium oxide particles, a dispersant, a water-soluble polymer having amino groups on the side chains and water, a polishing method by using the CMP abrasive slurry, and a semiconductor electronic part polished by the polishing method.