The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 17, 2013
Filed:
Jul. 04, 2008
Applicants:
Takaaki Tanaka, Kokubunji, JP;
Masato Fukasawa, Hitachi, JP;
Shigeru Nobe, Hitachi, JP;
Takafumi Sakurada, Hitachi, JP;
Takashi Shinoda, Hitachi, JP;
Inventors:
Takaaki Tanaka, Kokubunji, JP;
Masato Fukasawa, Hitachi, JP;
Shigeru Nobe, Hitachi, JP;
Takafumi Sakurada, Hitachi, JP;
Takashi Shinoda, Hitachi, JP;
Assignee:
Hitachi Chemical Co., Ltd., Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/302 (2006.01); H01L 21/461 (2006.01);
U.S. Cl.
CPC ...
Abstract
Provided are a polishing slurry for metal films and a polishing method which restrain the generation of erosion and seams, and makes the flatness of a surface polished therewith or thereby high. The slurry and the method are a polishing slurry, for metal films, comprising abrasive grains, a methacrylic acid based polymer and water, and a polishing method using the slurry, respectively.