The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 09, 2013
Filed:
Nov. 18, 2011
Jin Amanokura, Hitachi, JP;
Takafumi Sakurada, Hitachi, JP;
Sou Anzai, Hitachi, JP;
Masato Fukasawa, Hitachi, JP;
Shouichi Sasaki, Hitachi, JP;
Jin Amanokura, Hitachi, JP;
Takafumi Sakurada, Hitachi, JP;
Sou Anzai, Hitachi, JP;
Masato Fukasawa, Hitachi, JP;
Shouichi Sasaki, Hitachi, JP;
Hitachi Chemical Co., Ltd., Tokyo, JP;
Abstract
The present invention relates to polishing slurry and polishing method used for polishing in a process for forming wirings of a semiconductor device, and the like. There are provided polishing slurry giving a polished surface having high flatness even if the polished surface is made of two or more substances, and further, capable of suppressing metal residue and scratches after polishing, and a method of chemical mechanical polishing using this. The polishing slurry of the present invention is polishing slurry containing at least one of a surfactant and an organic solvent, and a metal oxide dissolving agent and water, or polishing slurry containing water and abrasive of which surface has been modified with an alkyl group, and preferably, it further contains a metal oxidizer, water-soluble polymer, and metal inhibitor.