The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 31, 2018

Filed:

Jan. 29, 2013
Applicant:

Hitachi Chemical Company, Ltd., Chiyoda-ku, Tokyo, JP;

Inventors:

Yasuhiro Ichige, Ibaraki, JP;

Kouji Haga, Ibaraki, JP;

Seiichi Kondo, Ibaraki, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/302 (2006.01); H01L 21/461 (2006.01); C09K 13/00 (2006.01); C03C 15/00 (2006.01); C03C 25/68 (2006.01); H01L 21/321 (2006.01); C23F 1/00 (2006.01); C09G 1/00 (2006.01); C23F 1/14 (2006.01); B24B 37/04 (2012.01); C09K 3/14 (2006.01); C09G 1/02 (2006.01);
U.S. Cl.
CPC ...
H01L 21/3212 (2013.01); B24B 37/044 (2013.01); C09G 1/00 (2013.01); C09G 1/02 (2013.01); C09K 3/1409 (2013.01); C09K 3/1463 (2013.01); C09K 3/1472 (2013.01); C23F 1/00 (2013.01); C23F 1/14 (2013.01);
Abstract

The present invention relates to a metal polishing liquid for polishing at least a part of metal in a substrate having the metal, comprising, component A: a metal solubilizer containing amino acids, component B: compounds having the benzotriazole skeleton, and component C: an acrylic acid polymer having the weight average molecular weight of 10,000 or more, and having the mass ratio between the component B and the component C, (component B:component C), to be 1:1 to 1:5. Use of the metal polishing liquid can simultaneously yield high polishing rates and low etching rates at higher level, enabling to form an embedded pattern with higher reliability.


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