The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 31, 2012
Filed:
Sep. 28, 2007
Kouji Haga, Hitachi, JP;
Yuto Ootsuki, Hitachi, JP;
Yasushi Kurata, Hitachi, JP;
Kazuhiro Enomoto, Hitachi, JP;
Kouji Haga, Hitachi, JP;
Yuto Ootsuki, Hitachi, JP;
Yasushi Kurata, Hitachi, JP;
Kazuhiro Enomoto, Hitachi, JP;
Hitachi Chemical Co., Ltd., Tokyo, JP;
Abstract
The present invention is directed to a CMP polishing slurry comprising cerium oxide particles, an organic compound having an acetylene bond (triple bond between carbon and carbon) and water, and a method for polishing a substrate which comprises a step of polishing a film to be polished of the substrate with the polishing slurry. In a CMP (chemical mechanical polishing) technique for flattening inter layer dielectrics, insulating films for shallow trench isolation and the like in a manufacturing process of semiconductor devices, the present invention enables the effective and high-speed polishing.