The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 15, 2014
Filed:
Jun. 06, 2007
Applicants:
Yasushi Kurata, Hitachi, JP;
Katsuyuki Masuda, Hitachi, JP;
Hiroshi Ono, Hitachi, JP;
Yasuo Kamigata, Hitachi, JP;
Kazuhiro Enomoto, Hitachi, JP;
Inventors:
Yasushi Kurata, Hitachi, JP;
Katsuyuki Masuda, Hitachi, JP;
Hiroshi Ono, Hitachi, JP;
Yasuo Kamigata, Hitachi, JP;
Kazuhiro Enomoto, Hitachi, JP;
Assignee:
Hitachi Chemical Co., Ltd., Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
C09K 13/04 (2006.01); C09K 3/14 (2006.01);
U.S. Cl.
CPC ...
Abstract
A polishing slurry including an oxidant, a metal oxide dissolver, a metal inhibitor and water and having a pH from 2 to 5. The polishing slurry having a high metal-polishing rate, reducing etching rate and polishing friction, results in the production, with high productivity, of semiconductor devices reduced in dishing and erosion in metal wiring.