IDiyas

For the Inventor, By the Inventor

Chikusei, Japan

Katsuyuki Masuda

USPTO Granted Patents = 24


Average Co-Inventor Count = 4.7

ph-index = 3

Forward Citations = 40(Granted Patents)


Location History:

  • Ibaraki, JP (2013)
  • Shimodate, JP (2008 - 2014)
  • Yuki, JP (2014)
  • Hitachi, JP (2014)
  • Tsukuba, JP (2016)
  • Chikusei, JP (2010 - 2019)

Company Filing History:

goldMedal24 out of 1,641 
 
Hitachi Chemical Company, Ltd.
 patents

Years Active: 2008-2019

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24 patents (USPTO):
1. 10328683 - Adhesive agent, adhesive material using the same, and method of use thereof (2019-06-25),
2. 10322572 - Adhesive agent, adhesive material using the same, and method of use thereof (2019-06-18),
3. 9457406 - Copper metal film, method for producing same, copper metal pattern, conductive wiring line using the copper metal pattern, copper metal bump, heat conduction path, bonding material, and liquid composition (2016-10-04),
4. 9446576 - Adhesive agent, adhesive material using the same, and method of use thereof (2016-09-20),
5. 8956732 - Polyamideimide resin, adhesive agent, material for flexible substrate, flexible laminate, and flexible print wiring board (2015-02-17),
6. 8815334 - Adhesion assisting agent-bearing metal foil, printed wiring board, and production method of printed wiring board (2014-08-26),
7. 8801971 - Copper conductor film and manufacturing method thereof, conductive substrate and manufacturing method thereof, copper conductor wiring and manufacturing method thereof, and treatment solution (2014-08-12),
8. 8696929 - Polishing slurry and polishing method (2014-04-15),
9. 8592546 - Silicon-containing alicyclic polyimide resin, polyamic acid resin, and manufacturing method for same (2013-11-26),
10. 8524921 - Liquid tetracarboxylic dianhydrides and process for the preparation thereof (2013-09-03),
11. 8507100 - Primer, conductor foil with resin, laminated sheet and method of manufacturing laminated sheet (2013-08-13),
12. 8501279 - Flexible laminate board, process for manufacturing of the board, and flexible print wiring board (2013-08-06),
13. 8486837 - Polishing slurry for metal, and polishing method (2013-07-16),
14. 8236906 - Polyamide-imide resin, process for production of polyamide resin, and curable resin composition (2012-08-07),
15. 7964289 - Formation method of metal layer on resin layer, printed wiring board, and production method thereof (2011-06-21),

Title: Innovator of Adhesive Technologies: Katsuyuki Masuda

Introduction: Katsuyuki Masuda, based in Chikusei, Japan, is a distinguished inventor known for his significant contributions to the field of adhesive technologies. With an impressive portfolio of 24 patents, his innovative spirit is evident in the latest developments in adhesive materials.

Latest Patents: Masuda's most recent patents focus on an adhesive agent that comprises a condensation resin formed through the polycondensation of polymerizable monomers. This includes a monomer (A) with two or more carboxyl groups and a monomer (B) boasting the same number of amino groups. His innovative work not only outlines the composition of the adhesive agent but also details an effective method of use. This advancement presents substantial potential for various applications in manufacturing and construction.

Career Highlights: Masuda has made a remarkable impact in his role at Hitachi Chemical Company, Ltd., where he continues to work on innovative adhesive solutions. His career is characterized by relentless pursuit of excellence which has led him to develop numerous patents that enhance the efficacy of adhesive agents used across different industries.

Collaborations: Throughout his career, Katsuyuki Masuda has collaborated with notable colleagues such as Kenji Takai and Norio Moriike. Their collective expertise and research efforts have contributed substantially to improving adhesive technologies and expanding their applications.

Conclusion: Katsuyuki Masuda stands as a prominent figure in the field of adhesive innovation. With 24 patents to his name and ongoing efforts at Hitachi Chemical Company, he is poised to influence the future of adhesive technologies, ensuring that they continue to meet the evolving needs of various sectors. His work not only exemplifies innovation but also strengthens the industry's foundation through collaborative efforts.

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