The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 06, 2013
Filed:
Oct. 19, 2006
Masahiko Suzuki, Chikusei, JP;
Kazuhito Obata, Chikusei, JP;
Katsuyuki Masuda, Chikusei, JP;
Kenichi Tomioka, Chikusei, JP;
Masaki Takeuchi, Chikusei, JP;
Sumio Yoshida, Chikusei, JP;
Hirokazu Suzuki, Chikusei, JP;
Yoshitsugu Matsuura, Chikusei, JP;
Masahiko Suzuki, Chikusei, JP;
Kazuhito Obata, Chikusei, JP;
Katsuyuki Masuda, Chikusei, JP;
Kenichi Tomioka, Chikusei, JP;
Masaki Takeuchi, Chikusei, JP;
Sumio Yoshida, Chikusei, JP;
Hirokazu Suzuki, Chikusei, JP;
Yoshitsugu Matsuura, Chikusei, JP;
Hitachi Chemical Company, Ltd., Tokyo, JP;
Abstract
A process for production of a flexible laminated sheet having one or more laminated bodies each provided with a metal foil formed on one side of a resin film, the process comprising a coating step in which a varnish containing a polyamic acid and a solvent is coated onto the metal foil to form a coated film, a holding step in which the coated film formed on the metal foil is held, a drying step in which at least a portion of the solvent in the varnish is removed to form a layer composed of a resin composition, and a resin film-forming step in which the layer composed of the resin composition is heated to form a resin film containing a polyimide resin. The conditions for each step from the coating step up to the resin film-forming step are adjusted based on a target for the content of metal elements in the resin film.