Company Filing History:

11 out of 1,075

Spansion Llc.

Cypress Semiconductor Corporation

patents

4. 2 out of 12

Fujitsu Automation Limited

patents

5. 1 out of 832,680

Other

patents

where one patent can have more than one assignee

Years Active: 1998-2016

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23 patents (USPTO):Sort by Forward Citations

Abstract keywords

1. 9368424 - Method of fabricating a semiconductor device used in a stacked-type semiconductor device (2016-06-14),

2. 9293441 - Semiconductor device and method of manufacturing the same (2016-03-22),

3. 9142440 - Carrier structure for stacked-type semiconductor device, method of producing the same, and method of fabricating stacked-type semiconductor device (2015-09-22),

4. 8174107 - Stacked semiconductor devices and a method for fabricating the same (2012-05-08),

5. 8030179 - Semiconductor device and method of manufacturing the same (2011-10-04),

6. 7851260 - Method for manufacturing a semiconductor device (2010-12-14),

7. 7846771 - Carrier for stacked type semiconductor device and method of fabricating stacked type semiconductor devices (2010-12-07),

8. 7696616 - Stacked type semiconductor device and method of fabricating stacked type semiconductor device (2010-04-13),

9. 7642637 - Carrier for stacked type semiconductor device and method of fabricating the same (2010-01-05),

10. 7622067 - Apparatus and method for manufacturing a semiconductor device (2009-11-24),

11. 7605457 - Semiconductor device and method of manufacturing the same (2009-10-20),

12. 7489029 - Carrier structure for stacked-type semiconductor device, method of producing the same, and method of fabricating stacked-type semiconductor device (2009-02-10),

13. 7414305 - Carrier for stacked type semiconductor device and method of fabricating stacked type semiconductor devices (2008-08-19),

14. 7285848 - Carrier for stacked type semiconductor device and method of fabricating the same (2007-10-23),

15. 6881611 - Method and mold for manufacturing semiconductor device, semiconductor device and method for mounting the device (2005-04-19),

Title: Innovations of Yasuhiro Shinma: A Pioneer in Semiconductor Fabrication

Introduction: Yasuhiro Shinma, based in Kanagawa, Japan, is a distinguished inventor with an impressive portfolio of 23 patents. His contributions to the semiconductor industry, particularly in the field of device fabrication, have marked him as a significant figure in the realm of technological advancements.

Latest Patents: Among his latest innovations, Shinma has developed a groundbreaking method for fabricating a semiconductor device utilized in stacked-type semiconductor configurations. This method involves providing a heat-resistant sheet over an interposer to cover electrode terminals and sealing a semiconductor chip with a sealing material. This innovative process mitigates contamination risks on electrode terminals, thus enhancing production yield by preventing resin burrs and protecting the integrity of electrode pads. Additionally, Shinma's semiconductor device design features stacked semiconductor chips equipped with insulating layers and conformed metal connections, further illustrating his dedication to improving semiconductor technologies.

Career Highlights: Throughout his career, Yasuhiro Shinma has collaborated with notable companies, including Spansion LLC and Fujitsu Corporation. His work at these organizations has significantly influenced the semiconductor sector, leading to advancements that prioritize efficiency and reliability in device fabrication.

Collaborations: Shinma has had the privilege of working alongside esteemed colleagues such as Junichi Kasai and Masanori Onodera. Their combined expertise in semiconductor technology has contributed to the successful development and implementation of various innovative methods and products in the industry.

Conclusion: Yasuhiro Shinma continues to be a key contributor to the field of semiconductor innovations. With an impressive number of patents to his name and a history of collaboration with industry leaders, his work exemplifies the spirit of innovation that drives the technological landscape forward.

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