The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 19, 2005
Filed:
Aug. 08, 2000
Norio Fukasawa, Kawasaki, JP;
Toshimi Kawahara, Kawasaki, JP;
Muneharu Morioka, Kawasaki, JP;
Mitsunada Osawa, Ushiku, JP;
Yasuhiro Shinma, Kawasaki, JP;
Hirohisa Matsuki, Kawasaki, JP;
Masanori Onodera, Kawasaki, JP;
Junichi Kasai, Kawasaki, JP;
Shigeyuki Maruyama, Kawasaki, JP;
Masao Sakuma, Kawasaki, JP;
Yoshimi Suzuki, Kawasaki, JP;
Masashi Takenaka, Kawasaki, JP;
Norio Fukasawa, Kawasaki, JP;
Toshimi Kawahara, Kawasaki, JP;
Muneharu Morioka, Kawasaki, JP;
Mitsunada Osawa, Ushiku, JP;
Yasuhiro Shinma, Kawasaki, JP;
Hirohisa Matsuki, Kawasaki, JP;
Masanori Onodera, Kawasaki, JP;
Junichi Kasai, Kawasaki, JP;
Shigeyuki Maruyama, Kawasaki, JP;
Masao Sakuma, Kawasaki, JP;
Yoshimi Suzuki, Kawasaki, JP;
Masashi Takenaka, Kawasaki, JP;
Fujitsu Limited, Kawasaki, JP;
Abstract
A method includes a resin sealing step of placing, in a cavityof a mold, a substrateto which semiconductor elementson which bumpsare arranged, a resin sealing step of supplying resinto positions of the bumpsso that a resin layersealing the bumpsis formed, a protruding electrode exposing step of exposing at least ends of the bumpssealed by the resin layerso that ends of the bumpsare exposed from the resin layer, and a separating step of cutting the substratetogether with the resin layerso that the semiconductor elementsare separated from each other.