IDiyas

For the Inventor, By the Inventor

Kawasaki, Japan

Mitsunada Osawa

USPTO Granted Patents = 10

Average Co-Inventor Count = 6.7

ph-index = 8

Forward Citations = 213(Granted Patents)


Location History:

  • Kawasaki, JP (1993 - 2002)
  • Ushiku, JP (2002 - 2005)

Company Filing History:

goldMedal8 out of 39,228 
 
Fujitsu Corporation
 patents
silverMedal4 out of 36 
 
Kyushu Fujitsu Electronics Limited
 patents
bronzeMedal1 out of 2 
 
Fujistsu Limited
 patents
4. 1 out of 832,680 
Other
 patents
where one patent can have more than one assignee

Years Active: 1993-2005

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10 patents (USPTO):Explore Patents
1. 6881611 - Method and mold for manufacturing semiconductor device, semiconductor device and method for mounting the device (2005-04-19),
2. 6696754 - Semiconductor module including a plurality of semiconductor devices detachably (2004-02-24),
3. 6472744 - Semiconductor module including a plurality of semiconductor devices detachably (2002-10-29),
4. 6379997 - Semiconductor device and method of producing the same and semiconductor device unit and method of producing the same (2002-04-30),
5. 6111306 - Semiconductor device and method of producing the same and semiconductor (2000-08-29),
6. 6034428 - Semiconductor integrated circuit device having stacked wiring and (2000-03-07),
7. 5844309 - Adhesive composition, semiconductor device using the composition and (1998-12-01),
8. 5804467 - Semiconductor device and method of producing the same (1998-09-08),
9. 5679978 - Semiconductor device having resin gate hole through substrate for resin (1997-10-21),
10. 5226582 - Method for wire-bonding an integrated circuit (1993-07-13),
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