Fujitsu Corporation

Kyushu Fujitsu Electronics Limited

Other

Fujistsu Limited

Mitsunada Osawa

Toshimi Kawahara

Junichi Kasai

Shinichirou Taniguchi

Mayumi Osumi

Yoshitugu Katoh

Hiroyuki Ishiguro

Shinya Nakaseko

Shigeyuki Maruyama

Hirohisa Matsuki

Kazuto Tsuji

Yoshiyuki Yoneda

Mitsutaka Sato

Toshio Hamano

Tetsuya Fujisawa

Yoshihiro Kubota

Yuji Sakurai

Sinya Nakaseko

Masanori Onodera

Yasuhiro Shinma

Masashi Takenaka

Norio Fukasawa

Yukio Takigawa

Muneharu Morioka

Masao Sakuma

Masaaki Seki

Akihiro Kubota

Takashi Hozumi

Yoshimi Suzuki

Shigeaki Yagi

Hiroyuki Ishiquro

A method includes a resin sealing step of placing, in a cavityof a mold, a substrateto which semiconductor elementson which bumpsare arranged, a resin sealing step of supplying resinto positions of the bumpsso that a resin layersealing the bumpsis formed, a protruding electrode exposing step of exposing at least ends of the bumpssealed by the resin layerso that ends of the bumpsare exposed from the resin layer, and a separating step of cutting the substratetogether with the resin layerso that the semiconductor elementsare separated from each other.

Method and mold for manufacturing semiconductor device, semiconductor device and method for mounting the device

A semiconductor module includes a plurality of semiconductor devices each including a circuit substrate carrying thereon a single memory semiconductor chip and a socket for holding the semiconductor devices detachably.

Semiconductor module including a plurality of semiconductor devices detachably

A semiconductor device includes a semiconductor element, a holding substrate holding the semiconductor element, a frame body provided on the holding substrate so as to surround the semiconductor element and having a hole which communicates to a space formed between the holding substrate and the frame body and the frame body and the holding substrate form a housing, a plurality of leads having inner lead portions connected to the semiconductor element and outer lead portions extending outside the frame body, and a resin filling the space and encapsulating the semiconductor element and the inner lead portions. All of the outer lead portions extend outside the housing from one side of the housing.

Semiconductor device and method of producing the same and semiconductor device unit and method of producing the same

Semiconductor device and method of producing the same and semiconductor

A semiconductor device includes a semiconductor chip, and a multi-layered member connected to the semiconductor chip. The multi-layered member includes one or a plurality of wiring layers and one or a plurality of insulating layers alternately stacked. The one or the plurality of insulating layers have holes. The multi-layered member has electrode parts which include deformed portions of the above one or the plurality of wiring layers obtained by deforming the above one or the plurality of wiring layers via said holes.

Semiconductor integrated circuit device having stacked wiring and

An adhesive composition including: a main component comprising a resin material, a solvent for dissolving said main component, and a filler added to said main component, wherein said filler has a particle size so as to make a concavo-convex depth of a surface of said adhesive composition equal to or less than 15 .mu.m after said adhesive composition is applied to an adherend and dried in order to evaporate said solvent before a thermocompression process. The present invention also discloses a semiconductor device using the adhesive composition, an adhering method using the adhesive composition and a method for producing a semiconductor device using the adhesive composition.

Adhesive composition, semiconductor device using the composition and

A semiconductor device includes a substrate having top and bottom surfaces, a semiconductor element mounted on the top surface of the substrate, and a resin package made of a resin and encapsulating the semiconductor element. The substrate includes at least one resin gate hole enabling the resin to be introduced from the bottom surface of the substrate via the resin gate hole when encapsulating the semiconductor element by the resin.

Semiconductor device and method of producing the same

Semiconductor device having resin gate hole through substrate for resin

A wire-bonding method of an IC uses a capillary having a hole for guiding a bonding wire, the capillary moving vertically and horizontally with respect to the IC so as to bridge a loop between a first bonding and a subsequent second bonding of the wire on predetermined places. The method comprises the steps of heating a wire end extruding from a first opening of the hole to form a ball of the wire; performing the first bonding by a nail head bonding method; pulling the wire coming from the second opening. The tension imposed on the wire hardens a portion of the wire having been softened during the heating process, but is adequately low not break the wire; and moving the capillary so as to perform the second bonding. In a wire-bonding apparatus including a spool and a capillary having a hole to guide the wire therethrough, where the capillary does a first bonding by a nail head bonding method and is movable vertically and horizontally so as to bridge a loop between the first bonding and a subsequent second bonding, there is provided a tension bar, located behind the capillary and rectangular to the wire, to hook the wire at a portion between the capillary and the spool located apart from the center line of the hole. The tension bar is movable from the capillary so as to pull the wire via the hole from the first bonding thus completed. Thus imposed tension hardens the portion of the wire soften by the heat process.

Method for wire-bonding an integrated circuit

Growing community of inventors

Kawasaki, Japan

Mitsunada Osawa