The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 07, 2000

Filed:

Nov. 08, 1996
Applicant:
Inventors:

Toshimi Kawahara, Kawasaki, JP;

Hiroyuki Ishiguro, Kawasaki, JP;

Mitsunada Osawa, Kawasaki, JP;

Shinichirou Taniguchi, Satsuma-gun, JP;

Mayumi Osumi, Kawasaki, JP;

Shinya Nakaseko, Kawasaki, JP;

Yoshitugu Katoh, Kawasaki, JP;

Junichi Kasai, Kawasaki, JP;

Assignees:

Fujitsu Limited, Kawasaki, JP;

Kyushu Fujitsu Electronics Limited, Kagoshima, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
257700 ; 257738 ; 257758 ;
Abstract

A semiconductor device includes a semiconductor chip, and a multi-layered member connected to the semiconductor chip. The multi-layered member includes one or a plurality of wiring layers and one or a plurality of insulating layers alternately stacked. The one or the plurality of insulating layers have holes. The multi-layered member has electrode parts which include deformed portions of the above one or the plurality of wiring layers obtained by deforming the above one or the plurality of wiring layers via said holes.


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