The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 08, 1998

Filed:

May. 13, 1997
Applicant:
Inventors:

Toshimi Kawahara, Kawasaki, JP;

Shinya Nakaseko, Kawasaki, JP;

Mitsunada Osawa, Kawasaki, JP;

Shinichirou Taniguchi, Kawasaki, JP;

Mayumi Osumi, Kawasaki, JP;

Hiroyuki Ishiguro, Kawasaki, JP;

Yoshitugu Katoh, Kawasaki, JP;

Junichi Kasai, Kawasaki, JP;

Assignees:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ; H01L / ;
U.S. Cl.
CPC ...
438112 ; 438124 ; 438126 ; 438127 ; 29841 ; 29855 ;
Abstract

A semiconductor device includes a substrate having top and bottom surfaces, a semiconductor element mounted on the top surface of the substrate, and a resin package made of a resin and encapsulating the semiconductor element. The substrate includes at least one resin gate hole enabling the resin to be introduced from the bottom surface of the substrate via the resin gate hole when encapsulating the semiconductor element by the resin.


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