The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 01, 1998
Filed:
Dec. 03, 1996
Yukio Takigawa, Kawasaki, JP;
Shigeaki Yagi, Yaizu, JP;
Toshimi Kawahara, Kawasaki, JP;
Mitsunada Osawa, Kawasaki, JP;
Hiroyuki Ishiguro, Kawasaki, JP;
Shinya Nakaseko, Kawasaki, JP;
Takashi Hozumi, Kanagawa, JP;
Masaaki Seki, Kawasaki, JP;
Fujitsu Limited, Kawasaki, JP;
Abstract
An adhesive composition including: a main component comprising a resin material, a solvent for dissolving said main component, and a filler added to said main component, wherein said filler has a particle size so as to make a concavo-convex depth of a surface of said adhesive composition equal to or less than 15 .mu.m after said adhesive composition is applied to an adherend and dried in order to evaporate said solvent before a thermocompression process. The present invention also discloses a semiconductor device using the adhesive composition, an adhering method using the adhesive composition and a method for producing a semiconductor device using the adhesive composition.