The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 6696754 B1

PDF
Full Text
Expired
Date of Patent:
Feb. 24, 2004

Filed:

Aug. 08, 2002
Applicant:
Inventors:

Mitsutaka Sato, Kawasaki, JP;

Tetsuya Fujisawa, Kawasaki, JP;

Shigeyuki Maruyama, Kawasaki, JP;

Junichi Kasai, Kawasaki, JP;

Toshimi Kawahara, Kawasaki, JP;

Toshio Hamano, Kawasaki, JP;

Yoshihiro Kubota, Kawasaki, JP;

Mitsunada Osawa, Ushiku, JP;

Yoshiyuki Yoneda, Kawasaki, JP;

Kazuto Tsuji, Kawasaki, JP;

Hirohisa Matsuki, Kawasaki, JP;

Assignee:

Fujitsu Limited, Kawasaki, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/334 ;
U.S. Cl.
CPC ...
H01L 2/334 ;
Abstract

A semiconductor module includes a plurality of semiconductor devices each including a circuit substrate carrying thereon a single memory semiconductor chip and a socket for holding the semiconductor devices detachably.


Find Patent Forward Citations

Sato, Mitsutaka. (2004). Semiconductor module including a plurality of semiconductor devices detachably (U.S. Patent No. 6696754). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6696754

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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