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For the Inventor, By the Inventor

Kawasaki, Japan

Toshio Hamano

This inventor holds 29 USPTO granted patents and 2 EPO patents, primarily in Semiconductor Devices. Top assignees: Fujitsu Corporation, Nhk Spring Co., Ltd., Kyushu Fujitsu Electronics Limited. Active years: 1986-2014.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Toshio Hamano. Retrieved from https://idiyas.com/inventor/toshio-hamano

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 29

% Patents Active = 89.7

 

Average Co-Inventor Count = 4.5

ph-index = 13

Forward Citations = 604(Granted Patents)


Location History:

  • San Jose, CA (US) (2002 - 2003)
  • Kawasaki, JP (1994 - 2007)
  • Yokohama, JP (1986 - 2014)

Company Filing History:

goldMedal25 out of 39,371 
 
Fujitsu Corporation
 patents
silverMedal4 out of 1,234 
 
Nhk Spring Co., Ltd.
 patents
bronzeMedal2 out of 36 
 
Kyushu Fujitsu Electronics Limited
 patents
where one patent can have more than one assignee

Years Active: 1986-2014

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Areas of Expertise:
Semiconductor Device
Heat Spreader
Multilayer Substrate
Assembly Board
Coil Spring
Surface Mount
Redistribution Layer
Plastic Package
Soldered Bond
Vertical Accumulation
Transmission Lines
Manufacturing Method
29 patents (USPTO):Explore Patents
1. 8695956 - Compression coil spring and manufacturing device and manufacturing method for coil spring (2014-04-15),
2. 7963510 - Compression coil spring device having a discrete support (2011-06-21),
3. 7193320 - Semiconductor device having a heat spreader exposed from a seal resin (2007-03-20),
4. 6696754 - Semiconductor module including a plurality of semiconductor devices detachably (2004-02-24),
5. 6627479 - Semiconductor device having a plurality of semiconductor elements interconnected by a redistribution layer (2003-09-30),
6. 6472744 - Semiconductor module including a plurality of semiconductor devices detachably (2002-10-29),
7. 6462424 - Semiconductor device, method of producing semiconductor device and semiconductor device mounting structure (2002-10-08),
8. 6460835 - Wheel suspension system and spring therefor (2002-10-08),
9. 6433418 - Apparatus for a vertically accumulable semiconductor device with external leads secured by a positioning mechanism (2002-08-13),
10. 6348728 - Semiconductor device having a plurality of semiconductor elements interconnected by a redistribution layer (2002-02-19),
11. 6347037 - Semiconductor device and method of forming the same (2002-02-12),
12. 6333564 - Surface mount type semiconductor device and method of producing the same having an interposing layer electrically connecting the semiconductor chip with protrusion electrodes (2001-12-25),
13. 6307259 - Plastic package for semiconductor device (2001-10-23),
14. 6288444 - Semiconductor device and method of producing the same (2001-09-11),
15. 6235997 - LSI package with equal length transmission Lines (2001-05-22),

Title: Toshio Hamano: Pioneering Inventor from Kawasaki

Introduction: Toshio Hamano is a renowned inventor hailing from Kawasaki, Japan, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Hamano's latest patents include advancements in robotics, artificial intelligence, and sustainable energy solutions, showcasing his commitment to pushing the boundaries of technological development.

Career Highlights: With a career spanning over three decades, Hamano has worked with leading tech companies in Japan, spearheading research and development projects that have led to the creation of cutting-edge products and solutions.

Collaborations: Throughout his career, Hamano has collaborated with top researchers, engineers, and scientists both locally and internationally, fostering a culture of innovation and knowledge sharing in the tech industry.

Conclusion: Toshio Hamano's dedication to innovation and his relentless pursuit of technological advancement have solidified his reputation as a visionary inventor in Kawasaki and beyond.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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