The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 25, 2001
Filed:
Jun. 21, 1999
Yoshitsugu Katoh, Kawasaki, JP;
Mitsutaka Sato, Kawasaki, JP;
Hiroshi Inoue, Kawasaki, JP;
Seiichi Orimo, Kawasaki, JP;
Akira Okada, Kawasaki, JP;
Yoshihiro Kubota, Nagano, JP;
Mitsuo Abe, Kawasaki, JP;
Toshio Hamano, Kawasaki, JP;
Yoshitaka Aiba, Kawasaki, JP;
Tetsuya Fujisawa, Kawasaki, JP;
Masaaki Seki, Kawasaki, JP;
Noriaki Shiba, Kawasaki, JP;
Fujitsu Limited, Kawasaki, JP;
Abstract
A semiconductor device and a method of producing the same, the device including a semiconductor chip; balls which function as external connecting terminals; a substrate which electrically connects the semiconductor chip and the balls; a mold resin which seals at least a part of the semiconductor chip; and a connecting portion sealing resin which seals the connecting portion between the substrate and the semiconductor chip. The semiconductor device is mounted onto a printed circuit board via the balls. The thermal expansion coefficient of the mold resin is matched with the thermal expansion coefficient of the printed circuit board. A side surface holding portion for the holding the side surfaces of the semiconductor chip is formed in the mold resin to restrict thermal deformation of the semiconductor chip.