Yoshitsugu Katoh

This inventor holds 8 USPTO granted patents. Top assignees: Fujitsu Corporation, Fujitsu Microelectronics Limited. Active years: 2001-2010.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yoshitsugu Katoh. Retrieved from https://idiyas.com/inventor/yoshitsugu-katoh

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 8

% Patents Active = 75.0

Average Co-Inventor Count = 4.5

ph-index = 6

Forward Citations = 243(Granted Patents)

Company Filing History:

Fujitsu Microelectronics Limited

patents

Years Active: 2001-2010

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8 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 7692294 - Semiconductor device and method for fabricating the same (2010-04-06),

2. 7682140 - Mold for resin molding, resin molding apparatus, and semiconductor device manufacture method (2010-03-23),

3. 6796024 - Method for making semiconductor device (2004-09-28),

4. 6559536 - Semiconductor device having a heat spreading plate (2003-05-06),

5. 6433418 - Apparatus for a vertically accumulable semiconductor device with external leads secured by a positioning mechanism (2002-08-13),

6. 6424032 - Semiconductor device having a power supply ring and a ground ring (2002-07-23),

7. 6333564 - Surface mount type semiconductor device and method of producing the same having an interposing layer electrically connecting the semiconductor chip with protrusion electrodes (2001-12-25),

8. 6288444 - Semiconductor device and method of producing the same (2001-09-11),

Title: Innovations of Yoshitsugu Katoh

Introduction

Yoshitsugu Katoh is a prominent inventor based in Kawasaki, Japan. He has made significant contributions to the field of semiconductor technology, holding a total of 8 patents. His work focuses on enhancing the efficiency and performance of semiconductor devices.

Latest Patents

One of his latest patents is for a semiconductor device and method for fabricating the same. This invention features a semiconductor device with a structure that has superior heat sink characteristics. A first heat sink member is positioned over a wiring board using an adhesive material. A semiconductor element is adhered to the first heat sink member, and the semiconductor element is connected to the electrodes on the wiring board by wires. A second heat sink member, which covers the semiconductor element and the wires, is joined to the first heat sink member using a conductive adhesive material. The interior and exterior of the second heat sink member are sealed with resin, except for a flat top. This design allows for effective heat dissipation from the semiconductor element through the heat sink members.

Another notable patent involves a mold for resin molding, which includes a pot for accommodating resin, a cavity for a semiconductor chip, and a runner for transporting resin. This mold features a foreign matter retention pocket that captures metallic foreign matter during the resin transport process, ensuring the integrity of the semiconductor device.

Career Highlights

Yoshitsugu Katoh has worked with notable companies such as Fujitsu Corporation and Fujitsu Microelectronics Limited. His experience in these organizations has allowed him to develop and refine his innovative ideas in semiconductor technology.

Collaborations

He has collaborated with esteemed colleagues, including Mitsuo Abe and Mitsutaka Sato, contributing to advancements in their respective fields.

Conclusion

Yoshitsugu Katoh's contributions to semiconductor technology through his patents and collaborations highlight his role as a key innovator in the industry. His work continues to influence the development of efficient semiconductor devices.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]