IDiyas

For the Inventor, By the Inventor

Kawasaki, Japan

Seiichi Orimo

USPTO Granted Patents = 12

Average Co-Inventor Count = 8.1

ph-index = 10

Forward Citations = 959(Granted Patents)


Company Filing History:

goldMedal12 out of 39,228 
 
Fujitsu Corporation
 patents

Years Active: 1997-2006

Loading Chart...
12 patents (USPTO):Explore Patents
1. 7144754 - Device having resin package and method of producing the same (2006-12-05),
2. 6856017 - Device having resin package and method of producing the same (2005-02-15),
3. 6433418 - Apparatus for a vertically accumulable semiconductor device with external leads secured by a positioning mechanism (2002-08-13),
4. 6333564 - Surface mount type semiconductor device and method of producing the same having an interposing layer electrically connecting the semiconductor chip with protrusion electrodes (2001-12-25),
5. 6288444 - Semiconductor device and method of producing the same (2001-09-11),
6. 6255740 - Semiconductor device having a lead portion with outer connecting terminals (2001-07-03),
7. 6159770 - Method and apparatus for fabricating semiconductor device (2000-12-12),
8. 6094356 - Semiconductor device and semiconductor device module (2000-07-25),
9. 6072239 - Device having resin package with projections (2000-06-06),
10. 6025650 - Semiconductor device including a frame terminal (2000-02-15),
11. 5930603 - Method for producing a semiconductor device (1999-07-27),
12. 5656550 - Method of producing a semicondutor device having a lead portion with (1997-08-12),

Title: Seiichi Orimo: Innovator in Resin Packaging Technology

Introduction

Seiichi Orimo is a prominent inventor based in Kawasaki, Japan. He has made significant contributions to the field of resin packaging technology, holding a total of 12 patents. His work focuses on enhancing the functionality and efficiency of electronic devices through innovative packaging solutions.

Latest Patents

One of Seiichi Orimo's latest patents is a device that includes a chip and a resin package sealing the chip. The resin package features resin projections located on the mount-side surface, with metallic films provided to these projections. Connecting parts are designed to electrically connect the electrode pads of the chip to the metallic film. This innovative design improves the reliability and performance of electronic devices.

Career Highlights

Seiichi Orimo is currently employed at Fujitsu Corporation, where he continues to develop cutting-edge technologies in the field of electronics. His expertise in resin packaging has positioned him as a key player in the industry, contributing to advancements that benefit various applications.

Collaborations

Throughout his career, Seiichi has collaborated with notable colleagues, including Kazuto Tsuji and Yoshiyuki Yoneda. These partnerships have fostered a creative environment that encourages innovation and the sharing of ideas.

Conclusion

Seiichi Orimo's work in resin packaging technology exemplifies the impact of innovative thinking in the electronics industry. His patents and collaborations highlight his commitment to advancing technology and improving device performance.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…