The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 20, 2007
Filed:
Jan. 28, 2003
Sumikazu Hosoyamada, Kawasaki, JP;
Yoshitsugu Kato, Kawasaki, JP;
Mitsuo Abe, Kawasaki, JP;
Kazuto Tsuji, Kawasaki, JP;
Masaharu Minamizawa, Kawasaki, JP;
Toshio Hamano, Kawasaki, JP;
Toshiyuki Honda, Kawasaki, JP;
Katsuro Hiraiwa, Kawasaki, JP;
Masashi Takenaka, Kawasaki, JP;
Sumikazu Hosoyamada, Kawasaki, JP;
Yoshitsugu Kato, Kawasaki, JP;
Mitsuo Abe, Kawasaki, JP;
Kazuto Tsuji, Kawasaki, JP;
Masaharu Minamizawa, Kawasaki, JP;
Toshio Hamano, Kawasaki, JP;
Toshiyuki Honda, Kawasaki, JP;
Katsuro Hiraiwa, Kawasaki, JP;
Masashi Takenaka, Kawasaki, JP;
Fujitsu Limited, Kawasaki, JP;
Abstract
A semiconductor element has a circuit formation surface on which electrode terminals are arranged in a peripheral part thereof. The semiconductor element is encapsulated by a mold resin on a substrate which has openings at positions corresponding to the electrodes of the semiconductor element. The semiconductor element is mounted to the substrate in a state where the circuit formation surface faces the substrate and the electrode terminals are positioned at the openings and a back surface opposite to the circuit formation surface of the semiconductor element is exposed from the mold resin. A heat-emitting member formed of a metal plate is provided on a surface of the substrate opposite to a surface on which the semiconductor element is mounted. The surface of the heat-emitting member being exposed from the mold resin.