The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 15, 2014
Filed:
Sep. 25, 2011
Toshio Hamano, Yokohama, JP;
Hideki Okada, Yokohama, JP;
Kenji Yamamotoya, Yokohama, JP;
NHK Spring Co., Ltd., Tokyo, JP;
Abstract
Bending deformation exceeding a yield stress is applied by winding a material on a mandrel. Coiling is performed simultaneously with the application of the bending deformation, and the load is removed after the coiling. This spring includes an outside surface region having a compressive residual stress and a compressive stress reduction region in which the compressive residual stress is reduced from the outside surface region toward the center of the material. A stress change portion at which a change from the compressive residual stress to a tensile residual stress occurs exists between the outside surface region and the center of the material. The spring further includes a tensile stress peak portion, tensile stress reduction region, and inside surface region. The inside surface region has the tensile compressive residual stress having an absolute value smaller than that of the outside surface region.