Fujitsu Corporation

Nhk Spring Co., Ltd.

Kyushu Fujitsu Electronics Limited

Toshio Hamano

Mitsutaka Sato

Masashi Takenaka

Yoshihiro Kubota

Masaharu Minamizawa

Masataka Mizukoshi

Kazuto Tsuji

Tetsuya Fujisawa

Makoto Iijima

Tetsushi Wakabayashi

Masaaki Seki

Taturou Yamashita

Yoshiyuki Yoneda

Seiichi Orimo

Katsuhiro Hayashida

Mitsuo Abe

Hiroshi Inoue

Yoshitaka Aiba

Yoshihiko Ikemoto

Yoshitsugu Katoh

Kenji Asada

Michio Hayakawa

Junichi Kasai

Shigeyuki Maruyama

Hirohisa Matsuki

Michio Sono

Hideharu Sakoda

Toshimi Kawahara

Ichiro Yamaguchi

Mitsunada Osawa

Kazuhiko Mitobe

Yukio Saigo

Naomi Miyaji

Masaru Nukiwa

Takeshi Takenaka

Takekiyo Saito

Hideki Okada

Toshiyuki Honda

Ryuji Nomoto

Akira Okada

Toshihiro Tachikawa

Masaki Waki

Masaya Komazaki

Takahiro Nakamura

Sumikazu Hosoyamada

Masahiro Umezawa

Kenji Yamamotoya

Katsuro Hiraiwa

Tomotake Kato

Hideji Aoki

Takao Akai

Noriaki Shiba

Iwao Shigeoka

Masanao Ueda

Hirotake Kato

Toshiyuki Kamakura

Shigeo Natsume

Kaoru Tachibana

Yoshitsugu Kato

Bending deformation exceeding a yield stress is applied by winding a material on a mandrel. Coiling is performed simultaneously with the application of the bending deformation, and the load is removed after the coiling. This spring includes an outside surface region having a compressive residual stress and a compressive stress reduction region in which the compressive residual stress is reduced from the outside surface region toward the center of the material. A stress change portion at which a change from the compressive residual stress to a tensile residual stress occurs exists between the outside surface region and the center of the material. The spring further includes a tensile stress peak portion, tensile stress reduction region, and inside surface region. The inside surface region has the tensile compressive residual stress having an absolute value smaller than that of the outside surface region.

Compression coil spring and manufacturing device and manufacturing method for coil spring

A compression coil spring device suitable for use in a strut wheel suspension system. The device includes a coil wire wound into a coil having an end turn. The end turn of the coil, and only the end turn of the coil, is provided with a plurality of projections along the length thereof, with the remainder of the coil wire being substantially free of projections.

Compression coil spring device having a discrete support

A semiconductor element has a circuit formation surface on which electrode terminals are arranged in a peripheral part thereof. The semiconductor element is encapsulated by a mold resin on a substrate which has openings at positions corresponding to the electrodes of the semiconductor element. The semiconductor element is mounted to the substrate in a state where the circuit formation surface faces the substrate and the electrode terminals are positioned at the openings and a back surface opposite to the circuit formation surface of the semiconductor element is exposed from the mold resin. A heat-emitting member formed of a metal plate is provided on a surface of the substrate opposite to a surface on which the semiconductor element is mounted. The surface of the heat-emitting member being exposed from the mold resin.

Semiconductor device having a heat spreader exposed from a seal resin

A semiconductor module includes a plurality of semiconductor devices each including a circuit substrate carrying thereon a single memory semiconductor chip and a socket for holding the semiconductor devices detachably.

Semiconductor module including a plurality of semiconductor devices detachably

A plurality of semiconductor chips are incorporated in a one-piece package so as to substantially increase a mounting area of a semiconductor device so that the semiconductor device can be provided with the projection electrodes having a structure which enable the semiconductor device to be mounted by a conventional surface mounting technique. A redistribution layer interconnects and integrally holds the plurality of semiconductor elements. A plurality of projection electrodes are provided on the redistribution layer for surface mounting. The plurality of semiconductor chips are rendered to be different kinds so that the plurality of different kinds of semiconductor chips together provide a complete function. The plurality of semiconductor chips may be rendered to be the same kind so as to reduce a mounting area of the semiconductor chips as a whole.

Semiconductor device having a plurality of semiconductor elements interconnected by a redistribution layer

A method of producing a semiconductor device includes a device body producing step, electrically coupling leads and a semiconductor chip, and producing a device body by encapsulating the semiconductor chip by a resin package so that portions of the leads are exposed from the resin package, a honing step, carrying out a honing process using a polishing solution at least with respect to a resin flash adhered on the portions of the leads exposed from the resin package, an etching step, removing an unwanted stacked layer structure formed on the leads by carrying out an etching process after the honing step, and a plating step, carrying out a plating process with respect to the leads after the etching step to form a plated layer made of a soft bonding material. The honing step removes a portion of the unwanted stacked layer structure in addition to the resin flash.

Semiconductor device, method of producing semiconductor device and semiconductor device mounting structure

Provided is a wheel suspension system ( ) and a spring ( ) therefor which can improve the ride comfort of the vehicle by reducing the sliding resistance between the cylinder and the piston of the tubular shock absorber ( ) surrounded by the compression coil spring without increasing the size of the suspension system and without complicating the assembly work. The compression coil spring is adapted to produce lateral forces between two ends thereof as the compression coil spring is extended and compressed by forming the coil spring so as to have cyclically varying pitch angle for each turn of the coil wire.

Wheel suspension system and spring therefor

A semiconductor device includes a resin package in which a semiconductor chip is sealed, the resin package having a first surface and a second surface opposite to the first surface; a plurality of leads having inner lead parts connected to the semiconductor chip and outer lead parts extending outside the resin package, the outer lead parts being bent along the shape of the resin package so as to form first terminal parts on the second surface and second terminal parts on the first surface; connection means electrically connecting the semiconductor chip and the leads; and a positioning mechanism provided either on the leads or on the resin package, which positions the outer lead parts by engaging a part of the outer lead parts to the resin package. Further, at least one of the leads and/or connection means is cut so as to electrically disconnect the semiconductor chip and the one of the leads and/or connection elements.

Apparatus for a vertically accumulable semiconductor device with external leads secured by a positioning mechanism

A semiconductor device includes a board and a semiconductor chip which is connected to an upper surface of the board via face-down bonding. The semiconductor device further includes a frame-shape member which is connected to the upper surface of the board with first adhesive, and has an opening to accommodate the semiconductor chip therein, and a plate-shape member which is situated to cover the semiconductor chip and the frame-shape member, and is connected to the semiconductor chip and the frame-shape member with second adhesive, wherein the frame-shape member has such a sufficient sturdiness as to prevent thermal-expansion-induced deformations of the board and the plate-shape member.

Semiconductor device and method of forming the same

A semiconductor device and a method of producing the same, the device including a semiconductor chip; balls which function as external connecting terminals; a substrate which electrically connects the semiconductor chip and the balls; a mold resin which seals at least a part of the semiconductor chip; and a connecting portion sealing resin which seals the connecting portion between the substrate and the semiconductor chip. The semiconductor device is mounted onto a printed circuit board via the balls. The thermal expansion coefficient of the mold resin is matched with the thermal expansion coefficient of the printed circuit board. A side surface holding portion for the holding the side surfaces of the semiconductor chip is formed in the mold resin to restrict thermal deformation of the semiconductor chip.

Surface mount type semiconductor device and method of producing the same having an interposing layer electrically connecting the semiconductor chip with protrusion electrodes

According to the present invention, for a multi-layer plastic package having bonding pads at multiple levels, a plurality of electrically independent side wall conductive layers can be provided by forming side wall conductive layer on the side wall of an opening in each insulating layer. In particular, when the insulating layer forms a multi-layer structure, side wall conductive layers are formed on each of the individual side walls of the multi insulating layers, and a pre-impregnated layer is inserted between each two insulation layers, so that a plurality of electrically independent side wall conductive layers can be provided. Even for an insulating layer having a single layer structure, side wall conductive layers are formed so as to be electrically separated from each other, so that a plurality of side wall conductive layers can be provided.

Plastic package for semiconductor device

A semiconductor device and a method of producing the semiconductor device are provided. This semiconductor device includes a semiconductor chip, a printed wiring board, a heat spreader, a sealing resin, and solder balls. The printed wiring board is provided with the solder balls on an outer portion and a wiring layer on an inner portion. Wires are bonded to the wiring layer, and an opening is formed in the center of the printed wiring board. The heat spreader is bonded to the printed wiring board, with the semiconductor chip being thermally connected to the stage portion of the heat spreader. The sealing resin is made up of a first sealing resin portion and a second sealing resin portion. The first and second sealing resin portions sandwich the heat spreader.

Semiconductor device and method of producing the same

An LSI package including an area for mounting an LSI device thereon and a plurality of lines for connecting the LSI device and external terminals. At least two of the plurality of lines, in which differential signals are transmitted and are adjacent to each other in the LSI package, have equal lengths.

LSI package with equal length transmission Lines

Growing community of inventors

Kawasaki, Japan

Toshio Hamano