The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 14, 2016
Filed:
May. 20, 2005
Yasuhiro Shinma, Isehara, JP;
Junichi Kasai, Kanagawa, JP;
Kouichi Meguro, Tokyo, JP;
Masanori Onodera, Tokyo, JP;
Junji Tanaka, Tokyo, JP;
Yasuhiro Shinma, Isehara, JP;
Junichi Kasai, Kanagawa, JP;
Kouichi Meguro, Tokyo, JP;
Masanori Onodera, Tokyo, JP;
Junji Tanaka, Tokyo, JP;
Cypress Semiconductor Corporation, San Jose, CA (US);
Abstract
A method of fabricating a semiconductor device includes the steps of providing a heat-resistant sheet on an interposer so as to cover electrode terminals provided on the interposer, and sealing a semiconductor chip on the interposer sandwiched between molds with a sealing material. The electrode terminals are covered by the heat-resistant resin for protection, and the semiconductor chip is then sealed with resin. It is thus possible to avoid the problem in which contaminations adhere to the electrode terminals. This makes it possible to prevent the occurrence of resin burrs on the interposer and contamination of the electrode pads and to improve the production yield.