The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 24, 2009
Filed:
May. 26, 2006
Yasuhiro Shinma, Kawasaki, JP;
Yasuhiro Shinma, Kawasaki, JP;
Spansion LLC, Sunnyvale, CA (US);
Abstract
An apparatus for manufacturing a semiconductor device includes an upper mold (), a lower mold (), and a plate () that includes at least one cavity () that receives resin and defines an outer shape and a thickness of a resin sealing portion, and a gate () through which the resin is guided to the cavity (), the plate () being interposed between the upper mold () and the lower mold (). The plate () further includes a resin film () fixed by viscoelastic or adhesive bonding to a side of thin plates () towards a substrate on which electrodes are provided. The semiconductor device is provided which has no resin burrs that occur on a substrate in an end portion of the molded body. The plate () is formed by multiple thin plates () joined by welding or positioned by positioning pins ().
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile