The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 10, 2009
Filed:
Aug. 30, 2005
Masanori Onodera, Tokyo, JP;
Kouichi Meguro, Tokyo, JP;
Junichi Kasai, Kanagawa, JP;
Yasuhiro Shinma, Kanagawa, JP;
Koji Taya, Kanagawa, JP;
Junji Tanaka, Tokyo, JP;
Masanori Onodera, Tokyo, JP;
Kouichi Meguro, Tokyo, JP;
Junichi Kasai, Kanagawa, JP;
Yasuhiro Shinma, Kanagawa, JP;
Koji Taya, Kanagawa, JP;
Junji Tanaka, Tokyo, JP;
Spansion LLC, Sunnyvale, CA (US);
Abstract
A carrier structure for fabricating a stacked-type semiconductor device includes: a lower carrier that has laminated thin plates and has first openings for mounting first semiconductor packages thereon; and an upper carrier having second openings for mounting second semiconductor packages on the first semiconductor packages. The lower carrier composed of the laminated thin plates realizes an even plate thickness and reduces warps because stress is distributed to the thin plates. This results in an improved production yield. A pattern of the openings in the thin plates of the lower carrier may be formed by etching or electric discharging. The openings thus formed have reduced warps and burrs.