The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 13, 2010

Filed:

Jan. 25, 2006
Applicants:

Yasuhiro Shinma, Kanagawa, JP;

Masanori Onodera, Tokyo, JP;

Kouichi Meguro, Tokyo, JP;

Koji Taya, Kanagawa, JP;

Junji Tanaka, Tokyo, JP;

Junichi Kasai, Kanagawa, JP;

Inventors:

Yasuhiro Shinma, Kanagawa, JP;

Masanori Onodera, Tokyo, JP;

Kouichi Meguro, Tokyo, JP;

Koji Taya, Kanagawa, JP;

Junji Tanaka, Tokyo, JP;

Junichi Kasai, Kanagawa, JP;

Assignee:

Spansion LLC, Sunnyvale, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/02 (2006.01);
U.S. Cl.
CPC ...
Abstract

A stacked type semiconductor device includes semiconductor devices, interposers by which the semiconductor devices are stacked, the interposers having electrodes provided on sides thereof, and a connection substrate connecting the electrodes together. The electrodes provided on the sides of the interposers may be connected to the connection substrate by one of an electrically conductive adhesive or an anisotropically conductive film.


Find Patent Forward Citations

Shinma, Yasuhiro. (2010). Stacked type semiconductor device and method of fabricating stacked type semiconductor device (U.S. Patent No. 7696616). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7696616

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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