This inventor holds 20 USPTO granted patents and 2 published patent applications, primarily in Integrated Circuit Packaging. Top assignee: Intel Corporation. Active years: 2006-2012.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Location History:
- Shanghai, CH (2007)
- Pu Dong, CN (2009)
- Shanghai, CN (2006 - 2012)
Company Filing History:
Years Active: 2006-2012
Areas of Expertise:
Title: Inventor Spotlight: Xiang Yin Zeng from Shanghai, China
Introduction
Xiang Yin Zeng is an accomplished inventor based in Shanghai, China. With a remarkable portfolio of 20 patents, her contributions have significantly impacted the field of technology and innovation. Currently working at Intel Corporation, Xiang has been at the forefront of developing advanced technologies, particularly in multi-chip assemblies and integrated capacitor structures.
Latest Patents
Xiang Yin Zeng's recent patents showcase her innovative spirit. One of her notable inventions is the "Multi-chip assembly with optically coupled die." This invention involves a multi-chip assembly comprising opposing substrates, where multiple die are mounted. Notably, this design allows for optical communication between at least one die on one substrate and at least one opposing die on another.
Another significant patent is for "Integrated capacitors in package-level structures, processes of making same, and systems containing same." This invention features a top electrode embedded in a solder mask, with processes that include reducing the solder mask’s thickness to form the top electrode over a high-K dielectric incorporated in a patterned core structure.
Career Highlights
Throughout her career, Xiang has shown exceptional talent in her field, cementing her role as a key player at Intel Corporation. Her work not only enhances the technological capabilities of her organization but also drives forward the advancement of electrical engineering and semiconductor technologies. Xiang's patents reflect her dedication to innovation and her commitment to solving complex engineering challenges.
Collaborations
Collaboration is vital in the world of innovation, and Xiang Yin Zeng has had the opportunity to work with talented colleagues such as Jiangqi He and Daoqiang Lu. Together, they have engaged in projects that leverage their combined expertise, fostering an environment of creativity and cutting-edge development.
Conclusion
Xiang Yin Zeng's impressive track record in patenting innovative technologies marks her as a leading figure in her field. Her work at Intel Corporation demonstrates her commitment to advancing technology through creativity and collaboration. The impact of her inventions, particularly in multi-chip assemblies and integrated capacitors, continues to shape the future of electronics. Her journey as an inventor is a testament to the power of innovation in driving progress in the technology sector.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile