The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 09, 2010
Filed:
Sep. 29, 2006
Jiamiao Tang, Shanghai, CN;
Daoqiang LU, Chandler, AZ (US);
Jiangqi He, Gilbert, AZ (US);
Xiang Yin Zeng, Shanghai, CN;
Jiamiao Tang, Shanghai, CN;
Daoqiang Lu, Chandler, AZ (US);
Jiangqi He, Gilbert, AZ (US);
Xiang Yin Zeng, Shanghai, CN;
Intel Corporation, Santa Clara, CA (US);
Abstract
A method includes mating a first heat spreader and a second heat spreader, such that the first heat spreader at a mating surface and second heat spreader at a mating surface become parallel and adjacent. The mated first heat spreader and second heat spreader have at least one convection channel disposed therebetween. A process includes placing a first die in a first die recess of the first heat spreader, and placing a second die on a second die site on the second heat spreader. The process includes reflowing thermal interface material between each die and respective heat spreader. A package is achieved by the method, with reduced thicknesses. The package can be coupled through a bumpless build-up layer. The package can be assembled into a computing system.