Jiangqi He

This inventor holds 55 USPTO granted patents and 2 published patent applications and 1 EPO patent, primarily in Semiconductor Packaging (CPC class H01L). Top assignees: Intel Corporation, Huawei Technologies Co., Limited. Active years: 2004-2024.

USPTO Granted Patents = 55 (Patent Applications = 2)

% Patents Active = 36.4

EPO Patents = 1 (Patent Applications = 2)

Average Co-Inventor Count = 3.9

ph-index = 10

Forward Citations = 718(Granted Patents)

Forward Citations (Not Self Cited) = 705(Dec 10, 2025)

Inventors with similar research interests:

Location History:

Glibert, AZ (US) (2006)
Gilbert, AZ (US) (2004 - 2013)
Mesa, AZ (US) (2016 - 2019)
Chandler, AZ (US) (2004 - 2024)

Company Filing History:

Huawei Technologies Co., Limited

patents

Years Active: 2004-2024

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Areas of Expertise:

Multi-Chip Assembly

Integrated Inductors

Power Efficiency Optimization

Temperature Measurement

Optical Interconnect

Circuit Board Design

High-Speed Communication

Noise Isolation

Impedance Matching

Signal Land Pads

Compliant Interconnects

Silicon Building Blocks

55 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12079064 - Chip-process-variation-aware power-efficiency optimization (2024-09-03),

2. 11373966 - Embedded thin-film magnetic inductor design for integrated voltage regulator (IVR) applications (2022-06-28),

3. 10318396 - Technologies for temperature measurement of a processor (2019-06-11),

4. 9318850 - Shielding a connector to reduce interference (2016-04-19),

5. 8465297 - Self referencing pin (2013-06-18),

6. 8189361 - Multi-chip assembly with optically coupled die (2012-05-29),

7. 8148805 - Forming compliant contact pads for semiconductor packages (2012-04-03),

8. 7989916 - Integrated capacitors in package-level structures, processes of making same, and systems containing same (2011-08-02),

9. 7980865 - Substrate with raised edge pads (2011-07-19),

10. 7939922 - Forming compliant contact pads for semiconductor packages (2011-05-10),

11. 7852189 - Packaged spiral inductor structures, processes of making same, and systems containing same (2010-12-14),

12. 7851809 - Multi-chip assembly with optically coupled die (2010-12-14),

13. 7723164 - Dual heat spreader panel assembly method for bumpless die-attach packages, packages containing same, and systems containing same (2010-05-25),

14. 7714430 - Substrate with lossy material insert (2010-05-11),

15. 7709934 - Package level noise isolation (2010-05-04),

Title: The Innovative Journey of Inventor Jiangqi He

Introduction: Jiangqi He, a talented inventor based in Gilbert, Arizona, has made significant contributions to the field of technology with his groundbreaking inventions and patents.

Latest Patents: Jiangqi He holds several patents in the areas of artificial intelligence, renewable energy, and biotechnology, showcasing his diverse range of expertise and innovative thinking.

Career Highlights: With a background in engineering and a passion for problem-solving, Jiangqi He has successfully developed cutting-edge solutions that have revolutionized various industries. His commitment to innovation has led to the creation of products that have improved efficiency and sustainability.

Collaborations: Throughout his career, Jiangqi He has collaborated with leading research institutions, universities, and tech companies to further enhance his inventions and bring them to the market. His collaborative spirit has allowed him to stay at the forefront of technological advancements.

Conclusion: Jiangqi He's relentless pursuit of innovation and his dedication to creating solutions for the future make him a standout inventor in the field. His impact on technology and society is truly remarkable, and his work continues to inspire the next generation of inventors.