The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 28, 2022

Filed:

Sep. 02, 2020
Applicant:

Huawei Technologies Co., Ltd., Shenzhen, CN;

Inventors:

Tae Hong Kim, Chandler, AZ (US);

Jiangqi He, Chandler, AZ (US);

Guotao Wang, Chandler, AZ (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/66 (2006.01); H01L 23/00 (2006.01); H01L 49/02 (2006.01);
U.S. Cl.
CPC ...
H01L 23/66 (2013.01); H01L 24/13 (2013.01); H01L 28/10 (2013.01); H01L 2223/6672 (2013.01); H01L 2924/1427 (2013.01);
Abstract

A package including a package substrate; an interposer electrically coupled to the package substrate and including a metal layer; a die including an integrated voltage regulator and electrically coupled to the interposer by solder features; and an inductor formed by a magnetic material disposed between two of the solder features electrically coupled to each other by a portion of the metal layer of the interposer, the inductor electrically coupled to the integrated voltage regulator.


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