The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 25, 2010
Filed:
Sep. 01, 2006
Daoqiang LU, Chandler, AZ (US);
Jiangqi He, Gilbert, AZ (US);
Xiang Yin Zeng, Shanghai, CN;
Jiamiao Tang, Shanghai, CN;
Daoqiang Lu, Chandler, AZ (US);
Jiangqi He, Gilbert, AZ (US);
Xiang Yin Zeng, Shanghai, CN;
Jiamiao Tang, Shanghai, CN;
Intel Corporation, Santa Clara, CA (US);
Abstract
A process includes mating a first heat spreader and a second heat spreader, such that the first heat spreader at a mating surface and second heat spreader at a mating surface become parallel and adjacent. The process includes placing a first die in a first die recess of the first heat spreader, and placing a second die in a second die recess in the second heat spreader. The process includes reflowing thermal interface material between each die and respective heat spreader. Thereafter, the process includes separating the first heat spreader and the second heat spreader. A package is achieved by the process, with reduced thicknesses. The package can be disposed onto a mounting substrate. The package can be assembled into a computing system.