The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 21, 2009
Filed:
Nov. 09, 2005
Applicants:
Qing A. Zhou, Chandler, AZ (US);
Daoqiang LU, Chandler, AZ (US);
Jiangqi He, Gilbert, AZ (US);
Wei Shi, Gilbert, AZ (US);
Xiang Yin Zeng, Pu Dong, CN;
Inventors:
Qing A. Zhou, Chandler, AZ (US);
Daoqiang Lu, Chandler, AZ (US);
Jiangqi He, Gilbert, AZ (US);
Wei Shi, Gilbert, AZ (US);
Xiang Yin Zeng, Pu Dong, CN;
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/12 (2006.01);
U.S. Cl.
CPC ...
Abstract
Disclosed are embodiments of a multi-chip assembly including optically coupled die. The multi-chip assembly may include two opposing substrates, and a number of die are mounted on each of the substrates. At least one die on one of the substrates is in optical communication with at least one opposing die on the other substrate. Other embodiments are described and claimed.