The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 31, 2009
Filed:
Dec. 29, 2005
Applicants:
John J. Tang, Shanghai, CN;
Xiang Yin Zeng, Shanghai, CN;
Jiangqi He, Gilbert, AZ (US);
Inventors:
Assignee:
Intel Corporation, Santa Clara, CA (US);
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/12 (2006.01);
U.S. Cl.
CPC ...
Abstract
Embodiments of the invention relate to the construction of a dual die package with a high-speed interconnect. A package is created having a first die on a first side of a base substrate and a second die on a second side of the base substrate in opposed relation to the first die. A first copper plated interconnect is plated to the base substrate. Second copper interconnects are formed to connect the first copper plated interconnect to the first and second dice, respectively, such that the first and second dice are interconnected.