John J Tang

Title: Innovations of John J Tang

Introduction

John J Tang is a prominent inventor based in Shanghai, China. He has made significant contributions to the field of electronics, particularly in the development of advanced packaging technologies. With a total of 4 patents to his name, Tang continues to push the boundaries of innovation in his industry.

Latest Patents

One of Tang's latest patents is titled "Integrated capacitors in package-level structures, processes of making same, and systems containing same." This invention includes a top electrode that is embedded in a solder mask, as well as a top electrode that is positioned on a core structure. The process of forming the top electrode involves reducing the solder mask thickness and forming the top electrode on the reduced-thickness solder mask. Additionally, the process includes forming the top electrode over a high-K dielectric that is in a patterned portion of the core structure.

Another notable patent is "Copper plating connection for multi-die stack in substrate package." This invention presents a technique to construct a multi-die package. A stack of dice is formed from a base substrate in a package, with the dice positioned one on top of another. The dice feature copper plated segments for die interconnection, and the interconnections are achieved using copper plating to connect these segments.

Career Highlights

John J Tang is currently employed at Intel Corporation, where he applies his expertise in electronics and packaging technologies. His work has been instrumental in advancing the capabilities of electronic devices, making them more efficient and compact.

Collaborations

Throughout his career, Tang has collaborated with talented individuals such as Xiang Yin Zeng and Jiangqi He. These collaborations have fostered innovation and contributed to the successful development of various technologies.

Conclusion

John J Tang's contributions to the field of electronics through his patents and work at Intel Corporation highlight his role as a leading inventor. His innovative approaches continue to shape the future of electronic packaging technologies.