William S Brennan

This inventor holds 57 USPTO granted patents, primarily in Semiconductor Fabrication (CPC class 4386). Top assignees: Advanced Micro Devices Corporation, Spansion LLC.. Active years: 1997-2014.

IDiyas Innovation Intelligence. (2026). Inventor Profile: William S Brennan. Retrieved from https://idiyas.com/inventor/william-s-brennan

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 57

% Patents Active = 94.7

Average Co-Inventor Count = 4.4

ph-index = 16

Forward Citations = 1,380(Granted Patents)

Forward Citations (Not Self Cited) = 1,354(Dec 10, 2025)

Inventors with similar research interests:

Company Filing History:

54 out of 13,175

Advanced Micro Devices Corporation

Years Active: 1997-2014

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Areas of Expertise:

Ultraviolet Blocking Layers

Chemical-Mechanical Polishing

Copper Interconnects

Dielectric Materials

Integrated Circuits

Conductive Layers

Vacuum Quality

Transistor Design

Gas Analyzer Techniques

Planarization

CVD Processes

Mask Generation

57 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 8643083 - Electronic devices with ultraviolet blocking layers (2014-02-04),

2. 8202810 - [object Object] (2012-06-19),

3. 8171627 - Method of forming an electronic device (2012-05-08),

4. 6955928 - Closed loop residual gas analyzer process control technique (2005-10-18),

5. 6809032 - Method and apparatus for detecting the endpoint of a chemical-mechanical polishing operation using optical techniques (2004-10-26),

6. 6800494 - Method and apparatus for controlling copper barrier/seed deposition processes (2004-10-05),

7. 6614064 - Transistor having a gate stick comprised of a metal, and a method of making same (2003-09-02),

8. 6555479 - Method for forming openings for conductive interconnects (2003-04-29),

9. 6514858 - Test structure for providing depth of polish feedback (2003-02-04),

10. 6489240 - Method for forming copper interconnects (2002-12-03),

11. 6413846 - Contact each methodology and integration scheme (2002-07-02),

12. 6395100 - Method of improving vacuum quality in semiconductor processing chambers (2002-05-28),

13. 6376330 - Dielectric having an air gap formed between closely spaced interconnect lines (2002-04-23),

14. 6353253 - Semiconductor isolation region bounded by a trench and covered with an oxide to improve planarization (2002-03-05),

15. 6326298 - Substantially planar semiconductor topography using dielectrics and chemical mechanical polish (2001-12-04),

Dear valued client, I am pleased to present to you an article about the esteemed inventor, William S Brennan, hailing from Austin, TX, USA. With an impressive portfolio of 57 patents, William S Brennan is a distinguished figure in the world of innovation and technology.

Latest Patents:

One of his latest patents is regarding electronic devices with ultraviolet blocking layers. These devices and systems are designed to insulate integrated circuits from harmful ultraviolet light, ensuring optimal functionality and protection of the technology. Additionally, he has developed a method for forming a single damascene and/or dual damascene contact and interconnect structure, demonstrating his expertise in intricate technological processes.

Career Highlights:

William S Brennan has contributed significantly to the industry through his work at renowned companies such as Advanced Micro Devices and Spansion LLC. His innovative solutions and technological advancements have undoubtedly made a lasting impact in the field of technology.

Collaborations:

Throughout his career, William S Brennan has collaborated with esteemed individuals in the industry, including Fred N Hause and Robert Louis Dawson. These collaborations have led to the development of groundbreaking technologies and inventions, further solidifying his reputation as a key figure in the field.

In conclusion, William S Brennan's dedication to innovation, coupled with his extensive experience and expertise, has cemented his position as a leading inventor in the technology sector. His contributions continue to shape the landscape of the industry, leaving a lasting legacy of innovation and advancement.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]