The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 04, 2014

Filed:

May. 07, 2012
Applicants:

Bryon K. Hance, Austin, TX (US);

Brian D. White, Kyle, TX (US);

William Brennan, Austin, TX (US);

Joseph W. Wiseman, Austin, TX (US);

Allen Evans, Dripping Springs, TX (US);

Inventors:

Bryon K. Hance, Austin, TX (US);

Brian D. White, Kyle, TX (US);

William Brennan, Austin, TX (US);

Joseph W. Wiseman, Austin, TX (US);

Allen Evans, Dripping Springs, TX (US);

Assignee:

Spansion LLC, Sunnyvale, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/792 (2006.01); H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 29/40 (2006.01);
U.S. Cl.
CPC ...
Abstract

Devices and systems for insulating integrated circuits from ultraviolet ('UV') light are described. The device includes a conductive feature, a first and second UV blocking layer, a first and second insulating laver, and a conductive structure. The first insulating layer overlays the first UV blocking layer. A via opening extends through the first insulating layer and the first UV blocking layer. The second UV blocking layer overlays the first insulating laver. The second insulating layer overlays the second UV blocking layer. An interconnect trench is defined in the second insulating layer and second UV blocking layer. The conductive structure is electrically connected to the conductive feature and extends into the via opening and along the interconnect trench.


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