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For the Inventor, By the Inventor

Eagle, ID, United States of America

William Mark Hiatt

USPTO Granted Patents = 118 

 

Average Co-Inventor Count = 3.1

ph-index = 21

Forward Citations = 2,156(Granted Patents)


Inventors with similar research interests:


Location History:

  • Austin, TX (US) (1999)
  • Eagle, OH (US) (2008)
  • Charlotte, NC (US) (2010)
  • Eagle, ID (US) (2003 - 2024)

Company Filing History:

goldMedal108 out of 37,905 
 
Micron Technology Incorporated
 patents
silverMedal5 out of 580 
 
Aptina Imaging Corporation
 patents
bronzeMedal3 out of 428 
 
Round Rock Research, LLC
 patents
4. 2 out of 20,290 
 
Motorola Corporation
 patents

Years Active: 1999-2024

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118 patents (USPTO):
1. 12014958 - Microfeature workpieces and methods for forming interconnects in microfeature workpieces (2024-06-18),
2. 11476160 - Microfeature workpieces and methods for forming interconnects in microfeature workpieces (2022-10-18),
3. 11177175 - Microelectronic devices and methods for filling vias in microelectronic devices (2021-11-16),
4. 11075146 - Microfeature workpieces having alloyed conductive structures, and associated methods (2021-07-27),
5. 10541192 - Microfeature workpieces having alloyed conductive structures, and associated methods (2020-01-21),
6. 10446440 - Semiconductor devices comprising nickel— and copper—containing interconnects (2019-10-15),
7. 10062608 - Semiconductor devices comprising nickel- and copper-containing interconnects (2018-08-28),
8. 10010977 - Systems and methods for forming apertures in microfeature workpieces (2018-07-03),
9. 9737947 - Microfeature workpieces having alloyed conductive structures, and associated methods (2017-08-22),
10. 9653420 - Microelectronic devices and methods for filling vias in microelectronic devices (2017-05-16),
11. 9640433 - Methods of forming interconnects and semiconductor structures (2017-05-02),
12. 9607930 - Disabling electrical connections using pass-through 3D interconnects and associated systems and methods (2017-03-28),
13. 9452492 - Systems and methods for forming apertures in microfeature workpieces (2016-09-27),
14. 9343368 - Disabling electrical connections using pass-through 3D interconnects and associated systems and methods (2016-05-17),
15. 9337162 - Multi-component integrated circuit contacts (2016-05-10),

Title: The Innovative Journey of William Mark Hiatt

Introduction: William Mark Hiatt, a talented inventor hailing from Eagle, ID (US), has made significant contributions to the world of innovations with his creative mind and dedication to problem-solving.

Latest Patents: William Mark Hiatt's latest patents showcase his expertise in various fields, including technology, engineering, and design. His recent inventions have been recognized for their ingenuity and practicality.

Career Highlights: Throughout his illustrious career, William Mark Hiatt has demonstrated a remarkable ability to transform ideas into tangible inventions. His passion for innovation has led to the development of groundbreaking solutions that have positively impacted industries and communities.

Collaborations: William Mark Hiatt has collaborated with leading experts, researchers, and organizations to further enhance his inventions and bring them to the market. His collaborative efforts have resulted in successful partnerships that have accelerated the innovation process.

Conclusion: William Mark Hiatt's journey as an inventor is a testament to his unwavering commitment to pushing the boundaries of what is possible. His innovative spirit and dedication to creating meaningful change continue to inspire others in the field of inventions.

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