The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 16, 2017

Filed:

Jun. 09, 2014
Applicant:

Micron Technology, Inc., Boise, ID (US);

Inventors:

William M. Hiatt, Eagle, ID (US);

Kyle K. Kirby, Eagle, ID (US);

Assignee:

Micron Technology, Inc., Boise, ID (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 21/683 (2006.01); H01L 21/768 (2006.01); H01L 23/48 (2006.01); H01L 25/065 (2006.01); H01L 25/00 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 24/14 (2013.01); H01L 21/6835 (2013.01); H01L 21/76898 (2013.01); H01L 23/481 (2013.01); H01L 23/49816 (2013.01); H01L 25/0657 (2013.01); H01L 25/50 (2013.01); H01L 24/48 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48145 (2013.01); H01L 2225/06506 (2013.01); H01L 2225/06541 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/01046 (2013.01); H01L 2924/01078 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/14 (2013.01); H01L 2924/181 (2013.01);
Abstract

Microelectronic devices and methods for filling vias and forming conductive interconnects in microfeature workpieces and dies are disclosed herein. In one embodiment, a method includes providing a microfeature workpiece having a plurality of dies and at least one passage extending through the microfeature workpiece from a first side of the microfeature workpiece to an opposite second side of the microfeature workpiece. The method can further include forming a conductive plug in the passage adjacent to the first side of the microelectronic workpiece, and depositing conductive material in the passage to at least generally fill the passage from the conductive plug to the second side of the microelectronic workpiece.


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