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For the Inventor, By the Inventor

Hsinchu, Taiwan

Weng-Dah Ken

This inventor holds 14 USPTO granted patents and 2 published patent applications and 1 EPO patent. Top assignees: Etron Technology, Inc., Invention and Collaboration Laboratory Pte. Ltd., Other. Active years: 2015-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Weng-Dah Ken. Retrieved from https://idiyas.com/inventor/weng-dah-ken

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 14 

% Patents Active = 100.0

 

Average Co-Inventor Count = 1.8

ph-index = 3

Forward Citations = 24(Granted Patents)


Company Filing History:

goldMedal9 out of 304 
 
Etron Technology, Inc.
 patents
silverMedal2 out of 55 
 
Invention and Collaboration Laboratory Pte. Ltd.
 patents
bronzeMedal3 out of 834,513 
Other
 patents

Years Active: 2015-2026

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14 patents (USPTO):Explore Patents
1. 12598765 - Transistor with low leakage currents and manufacturing method thereof (2026-04-07),
2. 12226246 - Ultra-precision timing clock method (2025-02-18),
3. 11990548 - Transistor with low leakage currents and manufacturing method thereof (2024-05-21),
4. 11903755 - Non-contact angle measuring apparatus (2024-02-20),
5. 10604203 - Green bike (2020-03-31),
6. 10504603 - System-in-package module with memory (2019-12-10),
7. 9940292 - Reconfigurable high speed memory chip module and electronic device with a reconfigurable high speed memory chip module (2018-04-10),
8. 9798692 - Reconfigurable high speed memory chip module and electronic device with a reconfigurable high speed memory chip module (2017-10-24),
9. 9748002 - System-in-package module with memory (2017-08-29),
10. 9601456 - System-in-package module and manufacture method for a system-in-package module (2017-03-21),
11. 9312254 - Semiconductor multi-project or multi-product wafer process (2016-04-12),
12. 9201834 - Reconfigurable high speed memory chip module and electronic device with a reconfigurable high speed memory chip module (2015-12-01),
13. 9164942 - High speed memory chip module and electronics system device with a high speed memory chip module (2015-10-20),
14. 9140978 - Semiconductor multi-project or multi-product wafer process (2015-09-22),

Title: Inventor Weng-Dah Ken

Introduction: Weng-Dah Ken is a renowned inventor based in Hsinchu, Taiwan, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Weng-Dah Ken holds several patents in the areas of semiconductor devices, nanotechnology, and renewable energy technologies, showcasing his diverse expertise and forward-thinking approach.

Career Highlights: With a career spanning over two decades, Weng-Dah Ken has worked with leading research institutions and technology companies, playing a key role in developing cutting-edge solutions that have revolutionized the industry.

Collaborations: Throughout his career, Weng-Dah Ken has collaborated with top engineers, scientists, and researchers from around the world, fostering a culture of innovation and excellence in all his projects.

Conclusion: Weng-Dah Ken's passion for innovation and his relentless pursuit of technological advancement continue to inspire the next generation of inventors and shape the future of technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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