The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 10, 2019
Filed:
Jul. 24, 2017
Applicant:
Etron Technology, Inc., Hsinchu, TW;
Inventors:
Weng-Dah Ken, Hsinchu, TW;
Chao-Chun Lu, Taipei, TW;
Assignee:
Etron Technology, Inc., Hsinchu, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G11C 29/02 (2006.01); H01L 25/18 (2006.01); G06F 11/10 (2006.01); H01L 25/065 (2006.01); G11C 5/04 (2006.01); G11C 11/00 (2006.01); G11C 29/56 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 25/10 (2006.01);
U.S. Cl.
CPC ...
G11C 29/023 (2013.01); G06F 11/106 (2013.01); G11C 5/04 (2013.01); G11C 11/005 (2013.01); H01L 25/0657 (2013.01); H01L 25/18 (2013.01); H01L 23/3128 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/17 (2013.01); H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 24/81 (2013.01); H01L 25/0652 (2013.01); H01L 25/105 (2013.01); H01L 2224/131 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/16146 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/17181 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/73207 (2013.01); H01L 2224/73253 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/81193 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06541 (2013.01); H01L 2225/06568 (2013.01); H01L 2225/06589 (2013.01); H01L 2225/1023 (2013.01); H01L 2225/1058 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/1431 (2013.01); H01L 2924/1434 (2013.01); H01L 2924/1436 (2013.01); H01L 2924/1437 (2013.01); H01L 2924/15151 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/181 (2013.01); H01L 2924/1815 (2013.01); H01L 2924/18161 (2013.01);
Abstract
A system-in-package module with memory includes a non-memory chip, a substrate, and a memory chip. The non-memory chip has a first portion and a second portion. The substrate has a window and the substrate is electrically connected to the second portion of the non-memory chip. The memory chip is placed into the window of the substrate to electrically connect the first portion of the non-memory chip, and there is no direct metal connection between the memory chip and the substrate.