San Mateo, CA, United States of America

Vladimir Korobov

This inventor holds 21 USPTO granted patents and 8 published patent applications and 2 EPO patents, primarily in Image Sensor Technology. Top assignees: Semiconductor Components Industries, LLC, Cypress Semiconductor Corporation, On Semiconductor Trading, Ltd.. Active years: 2002-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Vladimir Korobov. Retrieved from https://idiyas.com/inventor/vladimir-korobov

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 21 

% Patents Active = 95.2

 

Average Co-Inventor Count = 2.6

ph-index = 4

Forward Citations = 52(Granted Patents)


Location History:

  • Kfar Saba, IL (2002)
  • San Mateo, CA (US) (2010 - 2021)

Company Filing History:


Years Active: 2002-2026

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Areas of Expertise:
High Dynamic Range Imaging
Die Stacked Image Sensors
Imaging Systems
Charge Transfer Path
Floating Region
Hybrid Bonded Image Sensor
Global Shutter Pixels
Reflective Waveguide
Reverse MIM Capacitor
Capacitor Fabrication
Single Layer Sensor Pattern
Through-Oxide Via Connections
21 patents (USPTO):Explore Patents

Title: Innovations of Vladimir Korobov in Imaging Technologies

Introduction

Vladimir Korobov, based in San Mateo, CA, is an accomplished inventor with a remarkable portfolio of 20 patents. His extensive work has significantly influenced the field of imaging technologies, particularly in the development of advanced image sensors. His latest innovations showcase cutting-edge techniques that enhance the performance and capabilities of imaging systems.

Latest Patents

Among his notable patents, Vladimir has developed a pioneering system for die stacked image sensors and related methods. This implementation entails a first die containing multiple detectors designed to convert photons into electrons. In a unique configuration, this first die is hybrid bonded to a second die, which houses various transistors, passive electrical components, or a combination of both. Additionally, a third die equipped with analog and logic circuitry is fusion bonded to the second die. This intricate setup ensures the efficient operation of the detectors and performs essential signal routing for image processing.

Another significant patent focuses on imaging systems utilizing through-oxide via connections. This innovative imaging system includes an image sensor package where the die for the image sensor is connected to a digital signal processing die through these advanced connections. The design allows for a seamless interaction between the two dies, enhancing the system's overall functionality.

Career Highlights

Vladimir Korobov's professional journey includes noteworthy tenures at various prestigious companies such as Semiconductor Components Industries, LLC and Cypress Semiconductor Corporation. His expertise in semiconductor technology and image sensing has undoubtedly contributed to his reputation as a leading innovator in the industry.

Collaborations

Throughout his career, Vladimir has collaborated with esteemed colleagues Swarnal Borthakur and Marc Allen Sulfridge. These collaborations have facilitated the sharing of ideas and expertise, driving forward the advancement of imaging technologies.

Conclusion

Vladimir Korobov stands out as a significant contributor to the field of imaging technology through his inventive patents and professional engagements. His work not only enhances the functionality of image sensors but also paves the way for future innovations in the sector. As he continues to push the boundaries of technology, his contributions will likely have lasting impacts on the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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