Tzung-Hui Lee

This inventor holds 19 USPTO granted patents and 3 published patent applications, primarily in Semiconductor Packaging. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2018-2024.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Tzung-Hui Lee. Retrieved from https://idiyas.com/inventor/tzung-hui-lee

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

USPTO Granted Patents = 19 (Patent Applications = 3)

% Patents Active = 100.0

Average Co-Inventor Count = 4.2

ph-index = 3

Forward Citations = 17(Granted Patents)

Company Filing History:

19 out of 43,653

Taiwan Semiconductor Manufacturing Comp. Ltd.

patents

Years Active: 2018-2024

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Areas of Expertise:

Integrated Fan-Out

Semiconductor Device

Package Structure

Manufacturing Method

Integrated Circuit

Redistribution Structure

Fabrication Method

Circuit Package

Bond Pad

3D Packaging

Thermal Management

RDL Structure

19 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12094830 - Integrated fan-out (InFO) package structure (2024-09-17),

2. 11855014 - Semiconductor device and method (2023-12-26),

3. 11848233 - Semiconductor package and manufacturing method thereof (2023-12-19),

4. 11842955 - Method of making an integrated circuit package including an integrated circuit die soldered to a bond pad of a redistribution structure (2023-12-12),

5. 11410918 - Method of making an integrated circuit package including an integrated circuit die soldered to a bond pad of a carrier (2022-08-09),

6. 11398416 - Package structure and method of fabricating the same (2022-07-26),

7. 11393763 - Integrated fan-out (info) package structure and method (2022-07-19),

8. 11289410 - Integrated circuit packages and methods of forming same (2022-03-29),

9. 11289373 - Semiconductor package and manufacturing method thereof (2022-03-29),

10. 11217518 - Package structure and method of forming the same (2022-01-04),

11. 10867941 - Semiconductor device and method (2020-12-15),

12. 10867793 - Semiconductor package and method of fabricating the same (2020-12-15),

13. 10861814 - Integrated fan-out packages and methods of forming the same (2020-12-08),

14. 10510646 - Packae structure, RDL structure and method of forming the same (2019-12-17),

15. 10461023 - Semiconductor packages and methods of forming the same (2019-10-29),

Title: Tzung-Hui Lee: Pioneering Inventor from New Taipei

Introduction: Tzung-Hui Lee is a renowned inventor hailing from New Taipei, Taiwan, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Lee holds several patents in the areas of electronics, telecommunications, and renewable energy, showcasing his diverse range of expertise and innovative spirit.

Career Highlights: With a career spanning over two decades, Tzung-Hui Lee has worked with leading tech companies, research institutions, and universities, playing a key role in developing cutting-edge technologies that have revolutionized various industries.

Collaborations: Throughout his career, Lee has collaborated with top inventors, patent attorneys, and companies worldwide, fostering a culture of innovation and knowledge sharing that has led to numerous successful projects and inventions.

Conclusion: Tzung-Hui Lee's passion for innovation, coupled with his technical acumen and collaborative approach, continues to inspire the next generation of inventors and shape the future of technology.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

3 patents pending: