The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 08, 2020
Filed:
Apr. 30, 2018
Applicant:
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Inventors:
Tzung-Hui Lee, New Taipei, TW;
Chen-Hua Yu, Hsinchu, TW;
Chi-Ming Tsai, New Taipei, TW;
Hung-Jui Kuo, Hsinchu, TW;
Ming-Che Ho, Tainan, TW;
Assignee:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/538 (2006.01); H01L 21/48 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01); H01L 21/56 (2006.01); H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
H01L 24/19 (2013.01); H01L 21/481 (2013.01); H01L 21/486 (2013.01); H01L 21/4853 (2013.01); H01L 21/56 (2013.01); H01L 21/6835 (2013.01); H01L 23/3128 (2013.01); H01L 23/49811 (2013.01); H01L 23/5389 (2013.01); H01L 24/25 (2013.01); H01L 24/73 (2013.01); H01L 21/568 (2013.01); H01L 24/20 (2013.01); H01L 24/24 (2013.01); H01L 2221/68345 (2013.01); H01L 2221/68359 (2013.01); H01L 2221/68372 (2013.01); H01L 2221/68381 (2013.01); H01L 2224/18 (2013.01); H01L 2224/215 (2013.01); H01L 2224/24101 (2013.01); H01L 2224/24227 (2013.01); H01L 2224/25171 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73209 (2013.01); H01L 2224/73259 (2013.01); H01L 2224/73267 (2013.01); H01L 2224/83005 (2013.01); H01L 2224/8385 (2013.01);
Abstract
Integrated fan-out packages and methods of forming the same are disclosed. An integrated fan-out package includes a bump structure, a polymer layer and a metal layer. The bump structure includes a metal pad and a bump electrically connected to the metal pad. The polymer layer extends laterally from a sidewall of the bump. The metal layer is over the bump structure and in physical contact with a side surface of the metal pad.