The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 15, 2020
Filed:
May. 20, 2019
Applicant:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Inventors:
Chen-Hua Yu, Hsinchu, TW;
Ming-Che Ho, Tainan, TW;
Hung-Jui Kuo, Hsinchu, TW;
Yi-Wen Wu, Xizhi, TW;
Tzung-Hui Lee, New Taipei, TW;
Assignee:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 21/66 (2006.01); H01L 23/538 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 24/02 (2013.01); H01L 22/14 (2013.01); H01L 24/05 (2013.01); H01L 24/11 (2013.01); H01L 24/13 (2013.01); H01L 24/27 (2013.01); H01L 24/73 (2013.01); H01L 23/49811 (2013.01); H01L 23/49816 (2013.01); H01L 23/5389 (2013.01); H01L 24/03 (2013.01); H01L 24/16 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 2224/0215 (2013.01); H01L 2224/02125 (2013.01); H01L 2224/02185 (2013.01); H01L 2224/02315 (2013.01); H01L 2224/02375 (2013.01); H01L 2224/02379 (2013.01); H01L 2224/0345 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/05008 (2013.01); H01L 2224/05024 (2013.01); H01L 2224/05558 (2013.01); H01L 2224/05569 (2013.01); H01L 2224/10125 (2013.01); H01L 2224/11009 (2013.01); H01L 2224/1147 (2013.01); H01L 2224/11462 (2013.01); H01L 2224/13018 (2013.01); H01L 2224/13026 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/26125 (2013.01); H01L 2224/27009 (2013.01); H01L 2224/2747 (2013.01); H01L 2224/27462 (2013.01); H01L 2224/29018 (2013.01); H01L 2224/29036 (2013.01); H01L 2224/29147 (2013.01); H01L 2224/32227 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73203 (2013.01); H01L 2224/94 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/181 (2013.01);
Abstract
A semiconductor device and method of manufacturing is provided, whereby a support structure is utilized to provide additional support for a conductive element in order to eliminate or reduce the formation of a defective surface such that the conductive element may be formed to have a thinner structure without suffering deleterious structures.