The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 15, 2020
Filed:
Dec. 13, 2018
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Zi-Jheng Liu, Taoyuan, TW;
Hung-Jui Kuo, Hsinchu, TW;
Ming-Che Ho, Tainan, TW;
Ming-Tan Lee, Kaohsiung, TW;
Tzung-Hui Lee, New Taipei, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Abstract
A semiconductor package includes a substrate and a redistribution structure. The substrate has at least one contact. The redistribution structure is disposed on the substrate and electrically connected to the at least one contact, wherein the redistribution structure includes a plurality of redistribution layers. Each of the redistribution layers include a seed layer, a conductive material layer and a dielectric material layer. The conductive material layer is disposed on the seed layer. The dielectric material layer is surrounding the conductive material layer and the seed layer. At least one of the redistribution layers include an anti-reflective layer disposed in between the seed layer and the conductive material layer.